scsp
英
美
网络 叠层芯片尺寸封装; 叠层芯片封装元件
双语例句
- Optimization of the process parameters of SCSP device based on uniform design
以均匀设计法对SCSP器件工艺参数的优化 - Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化 - The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装（SCSP）器件在封装工艺过程中的热应力分布。 - The thesis sets up a model of the form of SCSP, as the core of this thesis, fully discusses the process and the harmonization management of the strategy cooperation.
论文还深入讨论了供应链战略合作伙伴关系的建立过程并建立了一个模型，详细探讨了合作关系建立的步骤，战略合作关系建立之后的协调管理问题，是本论文的核心内容之一。 - Deproteinization of shrimp and crab shell powder ( SCSP), deacetylation of chitin and depolymerization of chitosan in enzyme method were introduced completely in the article.
详细介绍了虾蟹壳酶法脱蛋白、甲壳素酶法脱乙酰及壳聚糖酶法降解这三方面的研究概况。 - Under the background, this thesis lucubrates the theme of supply chain strategy partnership ( SCSP for short) between the corporations on the basis of a great deal of literature in home and abroad.
本文正是在这种背景下，在参考了大量的国内外文献的基础上，就供应链上企业建立战略合作伙伴关系做了深入的研究。 - Investigation of Adhesive Fillet Height in SCSP by Finite Element Methods
有限元方法对SCSP粘结剂溢出问题的研究 - The proposed algorithm first employs the small cross search pattern ( SCSP) and large cross search pattern ( LCSP) to find small motion vectors with fewer search points based on cross-center-biased property.
该算法首先根据运动矢量概率分布的中心十字偏置性，采用小十字搜索模型（SCSP）和大十字搜索模型（LCSP）对小运动矢量进行搜索，从而减少搜索点数。 - Thermal stress analysis and fatigue life prediction for solder joint of SCSP
叠层芯片封装元件热应力分析及焊点寿命预测 - A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
研究了温度循环载荷下叠层芯片封装元件（SCSP）的热应力分布情况，建立了SCSP的有限元模型。 - The SIP is a great advanced IC package at the present. The MCP and the SCSP are a great future method for bring about the SIP.
SIP是当前最先进的IC封装，MCP和SCSP是实现SIP最有前途的方法。 - Lipoprotein with higher titer of SCSP showed higher killing ability on cancer cells.
SCSP的含量高，则对癌细胞的杀伤作用强。 - Moisture diffusion characteristics of SCSP available by experiments have been analyzed and typical moisture diffusion characteristics are calculated.
对实验中得到的湿气扩散特征进行分析，并对湿气扩散特征参数进行计算。 - Although SCSP has many merits, the reliability problems are needed to deeply study.
虽说SCSP有着许多优点，但其可靠性问题是值得深入研究。