multichip
英 [ˌmʌltɪˈtʃɪp]
美 [ˌmʌltiˈtʃɪp]
n. 多片（状）
双语例句
- COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。 - The single chip microcomputer of 8031 can be extended the multichip external program memory address: discussion
关于8031单片机扩展多片外部程序存储器地址问题的探讨 - This challenge makes multichip module ( MCM) a necessity.
这种挑战使得多芯片模块（MCM）成为必然的选择。 - Optoelectronic Multichip Modules and Its Application in High-speed Computer and Optical Communication Networks
光电多芯片模块及其在高速计算机和光通信网络中的应用 - In this paper, a method is set forth to the extending design of the MSI priority encoders, and its detailed procedure has been given. The method is suitable for the extending design of any multichip priority encoders.
阐述了MSI优先编码器的扩展方法和详细设计步骤，该方法适用于任意多片MSI优先编码器芯片的扩展设计。 - Technology of microwave multichip module
微波多芯片模块技术 - Using multichip module ( MCM) technology, The theory and design for the two-channel millimeter wave front-end is present in this thesis.
所以进行本课题的研究就非常有实际意义。本文采用多芯片组件（MCM）技术对毫米波双通道接收前端进行了理论分析和设计，，并且进行了制作和测试。 - This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。 - This dissertation is mainly on the research of S-band multichip module ( MCM) 4-bit digital phase shifter and switch section.
本论文主要是对S波段MCM四位数字移相器开关组件进行研究。 - Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging, multichip package and module MEMS are introduced.
介绍了几种当前先进的MEMS封装技术：倒装焊MEMS、多芯片（MCP）和模块式封装（MOMEMS）。 - FEA Method in the Thermal Performance of Multichip Module
有限元热分析法在大功率多芯片组件中的应用 - Characteristics simulation of MEMS packaging using multichip modules technology MCMs thermal design based on thermal-liquid structure and CFD coupling method
基于微机械系统的多芯片组件封装和特性模拟（英文）应用结构导热与CFD耦合的多芯片组件热设计 - Multichip module technology ( MCM) is the optimal way of providing circuit system miniaturization.
多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。 - Routing Techniques for Multichip Modules
多芯片组件的布线提案的技巧 - Application of Infrared Thermography Technology to Microwave Multichip Module
红外热像技术在微波多芯片组件中的应用 - As compared with traditional package technologies, multichip module ( MCM) technology has the higher packing densities and the more excellent characteristics.
与传统的封装技术相比，多芯片组装技术具有更高的封装密度和更优异的性能。 - 3-D Multichip Module ( MCM) is the developing trend of microelectronic packaging in the future.
3-D多芯片组件（MCM）是未来微电子封装的发展趋势。 - This paper describes the features of LTCC three dimension Multichip module technology, and analyzes the development trend of LTCC 3D-MCM.
本文概述了低温共烧陶瓷（LTCC）三维多芯片组件技术的特点，并分析LTCC3D-MCM的发展趋势。 - Interconnection line in multichip modules must be modeled in distributed RLC models. The process to obtain efficient and accurate delay fomulas for such transmission line is more comprehensive than the previous process for interconnection lines based on LC or RC models.
多芯片组件中互连线必须采用完整的RLC分布参数模型，要得到关于这样的传输线上的既准确又有效的延迟的解比以往建立在LC或RC线模型上的求解更具有综合性。 - A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules ( MCMs).
本文提出了一种用于求解高速VLSI和多芯片组件（MCM）中有耗互连线瞬态响应的稳定递归算法。 - This paper describes a multichip module having a copper-polyimide thin-film multiplayer substrate. This new substrate overcomes the problems of increased transmission loss at high frequencies while maintaining low crosstalk noise and the increased simultaneous switching noise with the large number of LSI chips.
介绍了一种采用铜-聚酰亚胺薄膜多层基板的多芯片组件（MCM），它解决了高频下维持较低交调噪声带来的传输损耗增大，以及大量LSI芯片的同时切换噪声增大的问题。 - Analysis of Interconnects in Multichip Module by Moment of Method
多芯片组件（MCM）中互连线系统的矩量法分析 - Analysis of electromagnetic interference spectrum in multichip modules
多芯片组件电磁干扰频谱中的两次峰值问题研究 - Thin Film Multichip Modules ( MCM) are new assembly process of chips, which can provide many advantages in improving system speed, decreasing system volume and cost.
薄膜MCM工艺是一种新兴的芯片安装工艺，它具有提高系统速度、降低系统体积及成本等优点。 - Routing Techniques for Multichip Modules Circled Joint Technology Used in Electronics Process
多芯片组件的布线无焊绕接工艺技术及其应用 - Interconnection Delay in High-speed Multichip Modules
高速多芯片组件的互连延迟 - Bonding interconnect is the critical technique for realizing the interconnect of microwave multichip module ( MCM). The height, distance and number of wires of bonding interconnect have important effects on its microwave characteristics.
键合互连是实现微波多芯片组件电气互连的关键技术，键合互连的拱高、跨距和金丝根数对其微波特性具有很大的影响。 - IBM Multichip Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density
IBM公司用大规模集成电路（LSI）芯片设计了多芯片多层陶瓷组件以提高性能和密度 - With the continuous development of technology for passive integrated and multichip package, the planar chip device is becoming an important researching direction.
随着无源集成与多芯片组装技术的发展，电子元器件也不断向小型片式化方向发展。